THE MAIN CONCERN WOULD BE IS THIS COPPER UNDERCOAT ACCEPTABLE TO THE CUSTOMER, AND DO TOLERANCES ALLOW FOR THE ADDED THICKNESS? GOOD LUCK. THIS MAY SEEM TO BE A SOMEWHAT CRUDE WAY OF PROCESSING, BUT HAS PROVEN TO BE VERY SUCCESSFUL WITH NO DAMAGE TO THE SUBSTRATE.
COPPER TELLURIUM FREE
NOTE: THIS PROCESS IS EFFECTIVE FOR FLUX FREE MATERIAL, IF FLUX IS PRESENT, SCRUBBING PRIOR TO A/C PLATE MAY BE REQUIRED. 4.) RINSE 5.) ACID COPPER PLATE (LIVE ENTRY) 20-40 ASF TO 100-200 MICROINCHES. THE MOST EFFECTIVE METHOD FOR ME HAS BEEN: 1.) REVERSE ELECTROCLEAN (4-6 OPG NAOH OR PROPRIETARY PRODUCT) 3-5 MINS at 4 VOLTS 2.) RINSE 3.) 25-40% HCl DIP 5-30 SECONDS. I HAVE HAD TO DEAL WITH THIS MATERIAL FOR MANY YEARS.
Industrial design - Fort Lauderdale, FloridaĪ. He is not familiar with this particular alloy and I was wondering if anyone has had any experience with it or recommendations that they would care to impart.Īgain, many thanks to and to all those who have taken the time to respond to inquiries such as this. I have the general impression that some of the free-machining alloys can create problems with the plating process and as a preventative measure, I am researching this issue to try to give our plating contractor as much information as possible and to try to anticipate and avoid any potential problems. We have designed a fitting that is to be produced in C14500 tellurium copper, because of its lead-free composition and good machinability, scheduled for bright silver plating as the final surface finish. We designers can never know enough about all of the different materials and processes that we encounter and it is wonderful to have sites like yours to help further our education. This site is what the Internet is all about and I would like to compliment you on its creation and maintenance.
I have spent hours reading through many of your letters and responses which has given me a wealth of information regarding the plating process. Possible to bright silver plate tellurium copper? Plating, anodizing, & finishing Q&As since 1989
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